Originated primarily in the interests of sustainability, the HERMA InNo-Liner system is currently receiving a boost because of a raw material bottleneck. “The market for the especially tear-resistant glassine papers that are siliconized for use as label release liner is under strain at the moment,” says Martin Kühl, Vice President HERMA Labeling Machines.
Mold-Tek Packaging Limited, a BSE-listed company, will set up a 50,000 sq ft plant with an investment of ₹50 crore to tap the injection blow moulding (IBM) packaging products market.
In 1980s, American Airlines saved $40,000 a year just by eliminating one olive from each passenger’s salad plate. This year, Apple has done away with plastic packing in the new iPhone 13 series, which will save 600 metric tonnes of plastic over the lifetime of the product. While this might not affect an individual, imagine the cumulative effect it would have on the environment. After all, Apple sells millions of iPhones, and even the smallest of changes can have a huge impact.
A startup named Samsara was launched on Tuesday to commercialise a new process using enzymes to turn plastic back into reusable building blocks, with Woolworths committing to buy the first 5,000 tonnes of material for packaging.
The OML-01140 high-speed open-mouth bagging machine is a unique, advanced, fast and versatile bagging equipment. This high-speed system, designed for bagging powdered or granular materials into open-mouth bags, has no equivalent on the market.
The government has sought public comments on the Draft Bill to declare the Indian Institute of Packaging (IIP) as an Institution of National Importance (INI) that would let it develop and conduct courses for graduate and post-graduate degrees, and post-doctoral courses, and undertake research on international marketing in packaging.
BOBST and its partners have announced a key milestone in their pioneering work to replace non-recyclable high barrier multi-material packaging structures with mono-material alternatives designed for recycling.
Elcoflex Ltd, based in Finland, an AIPIA member manufacturing copper based RFID antennas, has developed a new low-cost Smart Label concept based on a printed battery and readily available RFID chips. Current Smart Sensors use an embedded microprocessor system for analogue signal processing which, says the company, leads to a higher unit price.
ISBC, a Russia based RFID solutions developer has collaborated with AIPIA member, SAPPI – a global paper and packaging material supplier – to present an innovative new smart paper with embedded RFID chips.
Factors such as growing population, increasing income, burgeoning middle class, strong growth in organized retail and surge in e-commerce are driving the demand
SRF based in India have invested in a BOBST EXPERT K5 3650mm to further increase their production of high barrier BOPP films to meet the demand in the market both in India and internationally
The market survey carried out by PackIOT, in partnership with Instituto das Embalagens (Brazil), 360 Packaging (India and Asia) and People of Packaging (USA), reveals that more than half of the packaging producing industries are unable to point out in time where are the bottlenecks in the production line.
