Solvent-free adhesives for manufacturing flexible packaging laminates more sustainably

Solvent-free adhesives

SONGWON’s solvent-free laminating adhesives generate significant value for film converters through higher productivity and improved environmental compatibility.

HI-THANE™ A-7332 / HI-THANE™ A-6200 two-component, solvent-free polyurethane adhesive system is designed for printed or unprinted, metallized and laminate structures composed of polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP) and polyamide (PA) used for printing or barrier films, foil used for barrier films, and linear low-density polyethylene (LLDPE) and cast polypropylene (CPP) films used for sealing during pouch manufacture.

HI-THANE™ A-7332 / HI-THANE™ A-6200 is simple to process and handle and allows fast curing at room temperature. Since the adhesive is solvent-free and 100% reactive, less energy is used during application, curing and transportation than is required with conventional systems. These properties and features help to improve sustainability.

Source: Songwon Website

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